| TEL:86-755-23036376 E-mail:sales@cyypcb.com    |
| TEL:86-755-23036376 E-mail:sales@cyypcb.com |
Office: Room 905, Weifeng Bldg, Baoan Rd No.6301, Qiaotou Community, Fuyong St., Baoan District, Shenzhen Guangdong 518103 China
Factory: Shizhi Industrial Park, No. 362-2 Middle of Shihua Road, Daya Bay, Huizhou
Phone: +8613928411539
+86-13392838499
Tel: +86-75523036376
Fax: +86-75523049276
E-mail: sales@cyypcb.com
| Item | Technical Parameters | Specification | |||
| Min. Line Width(mil) | 3/4 | Partial 3mil lines is allowed | |||
| Min. Space(mil) | 3/4 | Partial 3mil lines is allowed | |||
| Min. Annular Ring Width(mil) | VIAS:3mil | Remained ring width means the distance between the hole edge to the ring outskirt | |||
| Component Holes:6mils | |||||
| Min. Hole Size | Board Thickness<2.0mm | 0.15mm | ___ | ||
| Board Thickness>=2.0mm | Aspect Ratio<=12 | ___ | |||
| Max. Board Thickness | Single and Double Sided | 5.0mm | |||
| Multilayer | 5.0mm | ||||
| Min. Board Thickness | Single and Double Sided | 0.2mm | |||
| Multilayer | 4 layers:0.4mm; 6 layers:0.6mm | ||||
| 8 layers:1.0mm;10 layers:1.2mm | |||||
| Max. Board Size | Single and Double Sided | 650*1100mm | |||
| Multilayer | 650*1100mm | ||||
| Distance between Line to Board edge | Outline:0.20mm | ||||
| V-CUT:0.4mm | |||||
| Max. Layers | 18 layers | ||||
| Solder mask | Mask Window(mil) | 2/4 | 1.Single side；2.2mil is allowed for mask bridge or avoiding exposed lines | ||
| Mask Bridge(mil) | 5 | Between IC pins | |||
| Color | Green Yellow Red Blue White Black Matt Green Matt Black | ___ | |||
| Legend | Min. Line Width(mil) | 4 | ___ | ||
| Color | White, Black, Yellow, ect. | ___ | |||
| Surface Plating | HAL(with Pb free),Plated Ni/Au,Ag, Imm Ni/Au,Imm Sn,Ag,OSP etc. | ___ | |||
| Plating Thickness (microinch) | Technique | Plating Type | Min. Thickness | Max. Thickness | |
| Plated Ni/Au | Ni | 100 | 150 | ||
| Au | 0.5 | 3 | |||
| Immersion Ni/Au | Ni | 100 | 150 | ||
| Au | 1 | 4 | |||
| Gold Finger | Ni | 120 | 150 | ||
| Au | 1.5 | 35 | |||
| Plat Gold | Au | 5 | 50 | ||
| Copper Plating Hole (micron) | Copper Thickness | 18 | 25 | ||
| Base Copper Thickness | Inner Layers and Outer Layers(OZ) | 0.5 | 4 | ||
| Finished Copper Thickness | Outer Layers | 1 | 5 | ||
| Inner Layers | 0.5 | 6 | |||
| Insulation Layer(mm) | 0.06 | ---- | |||
| Line Width/Space(mil) | Max. Copper Thickness | ___ | |||
| 4/4; 4/5 | 0.5 OZ | ___ | Line width shouldn't be less
| ||
| 4/6; 5/5; 6/5 | 1 OZ | ___ | |||
| 5/6; 6/6 | 2 OZ | ___ | |||
| 6/8; 7/8; 8/8 | 3 OZ | ___ | |||
| 8/10; 9/10; 10/10 | 5 OZ | ___ | |||
| Board Materials | FR-4; Aluminum Base; High Frequency; PFTE; FPC; Thick Copper; BT Base; Pi Base;Tg130℃/ Tg170℃,Rogers4003, Berquist, Thermagon, (Taconic) | ___ | |||
| Board Outline Tolerance: | |||||
| L<=100mm： 0.1mm; 100mm<L<=200mm： 0.2mm; 200mm<L<=300mm： 0.3mm: 300mm<L<=.....： 0.3mm | |||||
| Finished Product Thickness Tolerance: | |||||
| 0.2mm<T<0.5mm: +/-0.05mm; 0.5mm<T<0.8mm:>=0.8mm: +/-8% | |||||
| Impedance Control: | +/-10% | ||||
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